One of the "problems" that has, with the increase of speed, plagued DIP-packaged parts is the length of the leads, particularly power and gnd. Long wires inside the component package can't be improved by clever layout or thoughtful supply bypass. Signals adjacent to power and GND, at today's low power, couple pretty easily, and with the fast edges and large number of synchronous events, both the power and gnd, and the adjacent signals will "hear" the noise on the adjacent leads in the large lead frame.

Once you're prototyping, though, you should be using the product that goes in the target, and not something that just happens to fit your eval-kit socket.