Hi Jecksons,

Assuming you're using through hole technology, the main thing you need to concern yourself with when placing components on both sides of the board is making certain you don't create any "shadows" for the wave soldering process. In other words, don't put something where it will block the leading edge of the solder wave from impinging on the leads it's intended to solder. There are also trailing edge effects that can be an issue. This is something you should discuss with whoever will be doing the assembly, but just think about the dynamics of the wave during soldering when placing parts. Just like you don't want DIP packages oriented in the direction of travel, you basically don't want chips too close to TH leads.

You should also be aware that placing parts on the bottom of the board is going to force the inclusion of adhesive when placing the parts (to keep them in place when reflowing the top side parts).

Good luck,

Joe