The last five or six colleagues who've attempted to use BGA packaging for short-run (where they couldn't absorb several respins of the boards) products, have found that it requires, typically six reworks of the artwork PLUS x-ray inspection of each assembled board with the costly BGA's, and, at least with prototype houses here in the U.S, they get about a 1% yield, i.e. 10% of the finished PCB's will pass electrical test, and 10% of the assembled boards have successful attachment of the BGA's.

TQFP is generally the cheapest package that can be applied at reasonable cost, and, in fact, it's pretty easy if the boards have proper solder mask and the artwork has sensible component "footprints" in use. Some layout software packages, notably bEAGLE, have EVERY QFP/TQFP footprint WRONG! In the case of bEAGLE, the pads extend far enough below the package that solder can "float" the package such that it's difficult with just paste, to get proper attachment, and such that it's impossible to inspect the boards properly. I doubt bEAGLE is the only package that presents such a problem.

I've found that WINSLOW ADAPTICS doesn't want to sell some of their "standard" products, i.e. it's both quicker and less costly to make the equivalent yourself or to have it made and eBay the extras.

It's VERY easy to do a proper job of attaching TQFP/PQFP components. You don't even have to use paste. What you can to is take reasonable care soldering the component to the board by hand, opposing corners first, and subsequently "cleaning up" the solder bonds with solder-wick, which removes all the non-essential solder very well.

RE