| ??? 01/16/08 19:07 Read: times |
#149588 - perhaps you have missed the point Responding to: ???'s previous message |
Jon Ledbetter said:
Richard Erlacher said:
The PLCC is actually harder to solder to the board, despite its generous 0.050-inch pin pitch, than a 0.5 mm (0.020-inch) TQFP unless the board is "just-so". This is because its pads lie partially beneath the package, where they can't easily be inspected or cleaned up after soldering. Properly applied solder mask will prevent lots of problems.
RE This socket has .1" pitch --> http://www.usa-assmann.com/Specs/A-CCSxx-x-R.pdf I'd say no problem. Jon The through-hole socket has 0.100-inch pitch. The PLCC has 0.050-inch pitch, and the pads to which one has to solder, if one wishes to solder directly to the board, one has to deal with pads that reach underneath the package, which makes them hard to inspect and harder to clean up if soldering has gone badly. Since the sockets are becoming scarce and cost more than some of the PLCC-44 MCU's, it is worth taking all this into consideration. RE |
