You can only solder the pads one after each other if you have a very narrow tip, very big patience, a very stable hand, good eyesight, ...

The way to do it is to solder multiple pads, as shown on a large number of videos. You then clean up the soldering as a second step.

It doesn't matter if the solder tip is wide enough to solder 3 pins at the same time, since the goal is to get all pins in the row soldered before you switch to cleaning up any bridges.

Trying to solder the surface-mounted chips like you do a traditional DIL, where you quickly solder pin after pin, is not going to work.

Your goal is basically to simulate the wave used in some factory processes where you sweeps a awve of tin over all solder joints. But the PCB needs a solder mask, so you only expose the copper at the pads or the tin will also get stuck on the traces and create shorting bridges that may be hard to see.