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07/25/09 13:53
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#167883 - Hi Kai
Responding to: ???'s previous message
Guten Tag Kai,

Long time no "see." I hope all is well with you and yours.

What Rob wants to mention is very simple: If you have on the top layer many SMD parts with their many solder pads, how can you then have a solid ground plane on this layer at the same time?


As a rule, I wouldn't put the ground plane on the component side. I would make it the power plane (Vxx) instead. Of course, you still need to be deliberate about where you route any sensitive traces.

Concerning the matter of shielding between signal layers, and assuming this is a 4-layer stack up we're discussing, isolation would be whatever can be achieved by the orthogonality of the layers (just like on any 2-layer stack up). Of course, one also has the option of making it a 3-layer stack up, or 5 or 6 or ....

In the end, as is usually the case in engineering, the best design for any given pwb is going to be the result of many compromises, or trade-offs if you prefer. But if other circumstances don't make it impossible, sandwiching your signal layer(s) can very possibly save you having to install a faraday cage around your board. And if someone is making a lot of your board, that can be a significant savings.

Joe


List of 29 messages in thread
TopicAuthorDate
PCB design - ground plate...            01/01/70 00:00      
   excuse...            01/01/70 00:00      
   You can use a local ground plane, but...            01/01/70 00:00      
      So, if I understand it well...            01/01/70 00:00      
         Yes, of course, but...            01/01/70 00:00      
            Yes, but...            01/01/70 00:00      
               No overlap            01/01/70 00:00      
               Version B, but without FB...            01/01/70 00:00      
                  so...            01/01/70 00:00      
                     PCB layout...            01/01/70 00:00      
                        Answers...            01/01/70 00:00      
                           EMC            01/01/70 00:00      
                              Hhm, I wouldn't do that...            01/01/70 00:00      
                                 AC power supply            01/01/70 00:00      
                           ground vias            01/01/70 00:00      
                              Locating of vias...            01/01/70 00:00      
                                 Thank you very much...            01/01/70 00:00      
                     Sideplating? Thermal vias?            01/01/70 00:00      
   Stackup            01/01/70 00:00      
      Not such a good idea            01/01/70 00:00      
         interrupted/split planes            01/01/70 00:00      
            Elaboration            01/01/70 00:00      
               Thank you...            01/01/70 00:00      
               Nice link, Rob!            01/01/70 00:00      
               Elaboration            01/01/70 00:00      
                  Explanation            01/01/70 00:00      
                     Elaboration            01/01/70 00:00      
            What you propose isn't well suited for 4 layer boards            01/01/70 00:00      
               Hi Kai            01/01/70 00:00      

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