| ??? 07/21/09 15:08 Read: times |
#167663 - Stackup Responding to: ???'s previous message |
Hi Lukas,
If you are concerned about noise, and especially if you're concerned about interference, I suggest that you make the top and bottom layers your power/ground planes and sandwich your signal planes between them. Also, keep your signal traces away from the edges of the planes (fringing effects). Good luck, Joe P.S. For clarity's sake, by "noise" I mean signals emmanating from your board, and by "interference" I mean extraneous signals inducting into your board. |
| Topic | Author | Date |
| PCB design - ground plate... | 01/01/70 00:00 | |
| excuse... | 01/01/70 00:00 | |
| You can use a local ground plane, but... | 01/01/70 00:00 | |
| So, if I understand it well... | 01/01/70 00:00 | |
| Yes, of course, but... | 01/01/70 00:00 | |
| Yes, but... | 01/01/70 00:00 | |
| No overlap | 01/01/70 00:00 | |
| Version B, but without FB... | 01/01/70 00:00 | |
| so... | 01/01/70 00:00 | |
| PCB layout... | 01/01/70 00:00 | |
| Answers... | 01/01/70 00:00 | |
| EMC | 01/01/70 00:00 | |
| Hhm, I wouldn't do that... | 01/01/70 00:00 | |
| AC power supply | 01/01/70 00:00 | |
| ground vias | 01/01/70 00:00 | |
| Locating of vias... | 01/01/70 00:00 | |
| Thank you very much... | 01/01/70 00:00 | |
| Sideplating? Thermal vias? | 01/01/70 00:00 | |
| Stackup | 01/01/70 00:00 | |
| Not such a good idea | 01/01/70 00:00 | |
| interrupted/split planes | 01/01/70 00:00 | |
| Elaboration | 01/01/70 00:00 | |
| Thank you... | 01/01/70 00:00 | |
| Nice link, Rob! | 01/01/70 00:00 | |
| Elaboration | 01/01/70 00:00 | |
| Explanation | 01/01/70 00:00 | |
| Elaboration | 01/01/70 00:00 | |
| What you propose isn't well suited for 4 layer boards | 01/01/70 00:00 | |
Hi Kai | 01/01/70 00:00 |