| ??? 07/14/09 08:45 Modified: 07/14/09 08:47 Read: times |
#167223 - PCB design - ground plate... |
Hello all,
I would like to ask you for a help. I have a PCB consists of 4 layers with inner ground and power plate. I am solving 2 tasks: 1) To or not to pour the copper with ground potencial on the TOP and BOTTOM layer with a lot of vias connected to the ground plate because of free space and shielding. For example SMD ground pads of bypass capacitor will be connected to the BOOTOM ground "islands" (BOTTOM ground polygon will not be solid because of the signal lines) and then throught vias to inner ground plane... 2) I have switching regulator LM25574 on the BOTTOM layer and I am not sure if there should be the shared ground/power planes or place without polygon just under the regulator... I am afraid of the noise... I am searching forum and read the PCB design tutorial but exact answer has not been found yet... thank you very much for you help... regards There are the TOP and BOTTOM layers how I imagine them... 
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| Topic | Author | Date |
| PCB design - ground plate... | 01/01/70 00:00 | |
| excuse... | 01/01/70 00:00 | |
| You can use a local ground plane, but... | 01/01/70 00:00 | |
| So, if I understand it well... | 01/01/70 00:00 | |
| Yes, of course, but... | 01/01/70 00:00 | |
| Yes, but... | 01/01/70 00:00 | |
| No overlap | 01/01/70 00:00 | |
| Version B, but without FB... | 01/01/70 00:00 | |
| so... | 01/01/70 00:00 | |
| PCB layout... | 01/01/70 00:00 | |
| Answers... | 01/01/70 00:00 | |
| EMC | 01/01/70 00:00 | |
| Hhm, I wouldn't do that... | 01/01/70 00:00 | |
| AC power supply | 01/01/70 00:00 | |
| ground vias | 01/01/70 00:00 | |
| Locating of vias... | 01/01/70 00:00 | |
| Thank you very much... | 01/01/70 00:00 | |
| Sideplating? Thermal vias? | 01/01/70 00:00 | |
| Stackup | 01/01/70 00:00 | |
| Not such a good idea | 01/01/70 00:00 | |
| interrupted/split planes | 01/01/70 00:00 | |
| Elaboration | 01/01/70 00:00 | |
| Thank you... | 01/01/70 00:00 | |
| Nice link, Rob! | 01/01/70 00:00 | |
| Elaboration | 01/01/70 00:00 | |
| Explanation | 01/01/70 00:00 | |
| Elaboration | 01/01/70 00:00 | |
| What you propose isn't well suited for 4 layer boards | 01/01/70 00:00 | |
Hi Kai | 01/01/70 00:00 |