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???
10/09/07 23:19
Modified:
  10/09/07 23:21

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#145569 - Density
Responding to: ???'s previous message
Jan Waclawek said:
Was the spacing 0.100" between pins and 0.300"/0.600" between rows?

I don't think I have seen such. The only IDC in this density (0.100" spacing) I know is for the flat cable (either as the connector, 0.100" between rows, or as a plug into DIP sockets for emulators and such, 0.300"/0.600" between rows), which I don't believe would hold lose wires well enough. The lose-wire IDC's I know are either 0.150" or bigger spacing, and all of them are single-row; either IDC on both ends, or PCB, or connector.

I wonder what's the reason this technology did not evolve further.

I think there were two reasons ... cost and maintainability. You could build a very dense circuit with this technology, but because the wires were continuous, it was very difficult to modify a circuit as required due either to a mistake or a design change. I knew one fellow who bought a bunch of this hardware at considerable expense, yet couldn't use it, ultimately, because it was too difficult to modify. He hadn't yet discovered that there were "two-level" wire-wrap sockets, so his wire-wrap boards required he skip a slot between boards, and that didn't work in his Apple-][. In reality, it's never necessary to place more than two levels on a wire-wrap pin. People do it, but it's never necessary.

The patch-panels used in telephony and networking are all based on this technology and appears to be solid and reliable - and, for prototyping, it's certainly faster than to use the "plug-type" breadboard. I don't know anything about vibrations and such, but that's not an issue for a rapid prototype which would sit on a benchtop throughout its whole lifetime...

JW






List of 60 messages in thread
TopicAuthorDate
Wednesday survey            01/01/70 00:00      
   Yes            01/01/70 00:00      
      huh            01/01/70 00:00      
         I do!            01/01/70 00:00      
            can you two please hint on tag-strips?            01/01/70 00:00      
               The clue is in the name            01/01/70 00:00      
                  Another hint            01/01/70 00:00      
         nor do I!            01/01/70 00:00      
         nor do I!            01/01/70 00:00      
         "Printed" Circuit Boards            01/01/70 00:00      
            Tagstrips!            01/01/70 00:00      
   Yes            01/01/70 00:00      
      Pictures coming            01/01/70 00:00      
   Yes            01/01/70 00:00      
      Multi-layer            01/01/70 00:00      
         I do not know the reason, but I experienced            01/01/70 00:00      
            It was commonly done by hand for one-offs            01/01/70 00:00      
               Not Always            01/01/70 00:00      
                  true, however            01/01/70 00:00      
         Improved reliability            01/01/70 00:00      
   Yes            01/01/70 00:00      
   yes            01/01/70 00:00      
   yes            01/01/70 00:00      
   Not just for rapid prototyping ...            01/01/70 00:00      
      NASA used it too!            01/01/70 00:00      
   Yes            01/01/70 00:00      
   Old enough to remember delivering Machine Wrap            01/01/70 00:00      
      in a week or so ...            01/01/70 00:00      
      modified wrap            01/01/70 00:00      
   re:survey            01/01/70 00:00      
      another 10 points            01/01/70 00:00      
         IDCs used for IDB? Maybe?            01/01/70 00:00      
         re:IDC            01/01/70 00:00      
            DIL sockets?            01/01/70 00:00      
               re:DIL            01/01/70 00:00      
                  I remember these            01/01/70 00:00      
                     I agree            01/01/70 00:00      
                        there were several influences            01/01/70 00:00      
                  but this looks like - OK let's call it DIP...            01/01/70 00:00      
                     Density            01/01/70 00:00      
                        this is beyond my imagination            01/01/70 00:00      
                           skipped slots            01/01/70 00:00      
                              In some backplanes, they interfere            01/01/70 00:00      
                              Oh I see. Thanks.            01/01/70 00:00      
               DIL = DIP            01/01/70 00:00      
   How many points for these?            01/01/70 00:00      
      +10 points each...            01/01/70 00:00      
      How about "multiwire"            01/01/70 00:00      
         I remember those            01/01/70 00:00      
            i remember multiwire            01/01/70 00:00      
               Same as wirestitch and stitchweld            01/01/70 00:00      
   yes            01/01/70 00:00      
   Some serious wire-wrapping for you...            01/01/70 00:00      
      thanks            01/01/70 00:00      
      I see the wires, but where's the wrapping?            01/01/70 00:00      
         WHAT??? You want details?            01/01/70 00:00      
         some wirewrapping here...            01/01/70 00:00      
            God all mighty            01/01/70 00:00      
               and how much time doe is take...            01/01/70 00:00      
   Low cost, high volume wire wrapping            01/01/70 00:00      

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