Indeed. Since I am a big proponent for Solder Wick type products it is pretty easy to remove a solder blob from any pad configuration with relative ease. Several things to consider for design are...

Go with designs that do not have narrow pointy bits of copper. When removing links the heat from the soldering iron can let pointy ends easily delaminate from the board and possibly short across the gap. To that end if you use the design in my first picture of this thread use care to keep the radius of the arrow piece larger than the gap size and not as pointy as I drew it.

Use one of the recommended easy to solder designs as it creates a link without high amounts of solder blobbing. To much solder makes the removal with the wick a messy problem. Ideal situation would be that the link can be removed with just one application of the wick with the soldering iron. Of course there is selection of wick size and soldering iron tip to be taken into account too.

Make the jumper spot the right size. If the feature is 50 mils across it is already too big in my opinion. Likewise if it is sized at 20 mils across I think it is too small. I think that 30-40 mils is a good median feature size.

Michael Karas