| ??? 06/10/07 18:38 Modified: 06/10/07 18:40 Read: times |
#140514 - I\'d recommend a bit more effort ... Responding to: ???'s previous message |
I have used other parts of this type with mixed results. The most effective prototyping technique I've stumbled into using involves a very short piece of #30 (wire-wrap) wire sans insulation tacked to the lands of the device. This will promote wicking of the solder onto the pads and lands. A generous application of flux isn't a bad thing either. Since the wire will elevate the part above the board somewhat, it makes it easy to wash out the excess flux and it does make it possible to inspect the connections visually. If you see a proper, concave, meniscus, then the joint is good.
The fine-tipped soldering iron is, of course, an essential tool. RE |
| Topic | Author | Date |
| Looking for LGA Prototyping Advice | 01/01/70 00:00 | |
| Here Is The Extended Pads Idea | 01/01/70 00:00 | |
| Handworked | 01/01/70 00:00 | |
| Hoping to use iron.... | 01/01/70 00:00 | |
| Yes, | 01/01/70 00:00 | |
| Pre tin the component pads... | 01/01/70 00:00 | |
| PreTinning to Raise Device | 01/01/70 00:00 | |
| I\'d recommend a bit more effort ... | 01/01/70 00:00 | |
| I See | 01/01/70 00:00 | |
| Sort of like the CP210x | 01/01/70 00:00 | |
| LINK-good for 5 more days | 01/01/70 00:00 | |
| For two parts on two prototypes?? | 01/01/70 00:00 | |
For two parts on two prototypes?? | 01/01/70 00:00 | |
| More on SMT in the kitchen | 01/01/70 00:00 |