| ??? 06/10/07 12:19 Read: times |
#140505 - Handworked Responding to: ???'s previous message |
Michael Karas said:
So as before...If I made my prototype PCB using pads like this do you think it would be possible to reliably solder down the sensor device packages? Hi Mike, They are not dissimilar to handling some surface mount discrete parts, with similar buried connections which I have soldered. Use a soldering iron, with a very fine tip, rather than hot-air - we never got reliable joints by hot -air on that kind of part. Steve |
| Topic | Author | Date |
| Looking for LGA Prototyping Advice | 01/01/70 00:00 | |
| Here Is The Extended Pads Idea | 01/01/70 00:00 | |
| Handworked | 01/01/70 00:00 | |
| Hoping to use iron.... | 01/01/70 00:00 | |
| Yes, | 01/01/70 00:00 | |
| Pre tin the component pads... | 01/01/70 00:00 | |
| PreTinning to Raise Device | 01/01/70 00:00 | |
| I\'d recommend a bit more effort ... | 01/01/70 00:00 | |
| I See | 01/01/70 00:00 | |
| Sort of like the CP210x | 01/01/70 00:00 | |
| LINK-good for 5 more days | 01/01/70 00:00 | |
| For two parts on two prototypes?? | 01/01/70 00:00 | |
For two parts on two prototypes?? | 01/01/70 00:00 | |
| More on SMT in the kitchen | 01/01/70 00:00 |