| ??? 06/10/07 17:15 Read: times |
#140511 - Pre tin the component pads... Responding to: ???'s previous message |
Hello Michael,
I have not soldered a device such as that shown by you, in your photographs, but the nearest part I have hand soldered are a mlp package, (silab CP2103) and a nokia colour LCD connector, this connector was quite tricky, even a small mistake used to melt the whole connector rendering it useless. Here are my suggestions, pre tin the solder pads on the device, and the landing pads on the pcb, heating the pads with a fine tip soldering iron should wick the melted solder from the extended pads which you have planned. The only hinderence to this method I can think of is the epoxy on the device preventing the solder from flowing from the extended pad area, but if pads on the device and the pcb are tinned they should be slightly lifted up from the pcb allowing the melted solder to wick under the device. Regards, John. |
| Topic | Author | Date |
| Looking for LGA Prototyping Advice | 01/01/70 00:00 | |
| Here Is The Extended Pads Idea | 01/01/70 00:00 | |
| Handworked | 01/01/70 00:00 | |
| Hoping to use iron.... | 01/01/70 00:00 | |
| Yes, | 01/01/70 00:00 | |
| Pre tin the component pads... | 01/01/70 00:00 | |
| PreTinning to Raise Device | 01/01/70 00:00 | |
| I\'d recommend a bit more effort ... | 01/01/70 00:00 | |
| I See | 01/01/70 00:00 | |
| Sort of like the CP210x | 01/01/70 00:00 | |
| LINK-good for 5 more days | 01/01/70 00:00 | |
| For two parts on two prototypes?? | 01/01/70 00:00 | |
For two parts on two prototypes?? | 01/01/70 00:00 | |
| More on SMT in the kitchen | 01/01/70 00:00 |