| ??? 06/10/07 06:57 Read: times |
#140502 - Here Is The Extended Pads Idea Responding to: ???'s previous message |
The idea that I have devised to deal with hand soldering these sensors is as discussed here. These are expensive devices at between $20US to $55US so this scheme has to be reliable and not mess up trying to make it work and so hopefully some one here can provide some dialog on whether they think this concept can work.
Here is a picture of the bottom side of the sensors. Notice that these are LGA (land grid array) type devices with flat pads even with the bottom surface of the package. The center area of the package is some type of epoxy material that is recessed somewhat in what appears to be a miniature type of potted assembly.  The idea is to use a specially adapted surface mount land pattern that extends 1.5mm outside the edge of the part. Here is a picture that shows this: (Make sure to zoom the browser window to 100% picture size to see a clear picture image) ..or So as before...If I made my prototype PCB using pads like this do you think it would be possible to reliably solder down the sensor device packages? Michael Karas |
| Topic | Author | Date |
| Looking for LGA Prototyping Advice | 01/01/70 00:00 | |
| Here Is The Extended Pads Idea | 01/01/70 00:00 | |
| Handworked | 01/01/70 00:00 | |
| Hoping to use iron.... | 01/01/70 00:00 | |
| Yes, | 01/01/70 00:00 | |
| Pre tin the component pads... | 01/01/70 00:00 | |
| PreTinning to Raise Device | 01/01/70 00:00 | |
| I\'d recommend a bit more effort ... | 01/01/70 00:00 | |
| I See | 01/01/70 00:00 | |
| Sort of like the CP210x | 01/01/70 00:00 | |
| LINK-good for 5 more days | 01/01/70 00:00 | |
| For two parts on two prototypes?? | 01/01/70 00:00 | |
For two parts on two prototypes?? | 01/01/70 00:00 | |
| More on SMT in the kitchen | 01/01/70 00:00 |