| ??? 06/10/07 04:05 Read: times |
#140496 - Looking for LGA Prototyping Advice |
I am working on a project that makes use of some Analog Devices sensor devices that are in packages as shown at the following two links:
http://www.analog.com/UploadedF...C_12_1.pdf http://www.analog.com/UploadedF...C_16_1.pdf I fully understand the issues about using such devices on production type boards that are fabricated with state of the art reflow techniques. However I am in the position of doing this firmware project where I have to just fabricate a quick turn test board that attaches to some MCU processor EVB. In this case I make this board in such way that it is easy to build and easy to probe on. As such the design of suface mount part footprints can be made to enhance the hand assembled process!! Now my question... These parts have the pads completely under the part and a conventional set of reflow pads would similarly be completely under the part. Does anyone have any idea that if I made the pads stick outside the part outline by say 1.5 mm if I would be able to reliably solder these parts by hand? What tricks would be involved? Would I want to pre-tin the pads on the sensor part before soldering down to the PC board? Michael Karas |
| Topic | Author | Date |
| Looking for LGA Prototyping Advice | 01/01/70 00:00 | |
| Here Is The Extended Pads Idea | 01/01/70 00:00 | |
| Handworked | 01/01/70 00:00 | |
| Hoping to use iron.... | 01/01/70 00:00 | |
| Yes, | 01/01/70 00:00 | |
| Pre tin the component pads... | 01/01/70 00:00 | |
| PreTinning to Raise Device | 01/01/70 00:00 | |
| I\'d recommend a bit more effort ... | 01/01/70 00:00 | |
| I See | 01/01/70 00:00 | |
| Sort of like the CP210x | 01/01/70 00:00 | |
| LINK-good for 5 more days | 01/01/70 00:00 | |
| For two parts on two prototypes?? | 01/01/70 00:00 | |
For two parts on two prototypes?? | 01/01/70 00:00 | |
| More on SMT in the kitchen | 01/01/70 00:00 |