| ??? 06/10/07 17:23 Read: times |
#140512 - PreTinning to Raise Device Responding to: ???'s previous message |
John:
You are describing exactly what I had in mind. I will be getting the circuit boards from Sierra Proto Express and so the lands on the PC board will already have a good amount of solder present. But creating bumps on the Analog Devices parts will essentially convert them from LGAs to BGAs. Although the rectangular pads will lead to something more like mounds than balls. So call it "MGA package" assembly. :-) Mike Karas |
| Topic | Author | Date |
| Looking for LGA Prototyping Advice | 01/01/70 00:00 | |
| Here Is The Extended Pads Idea | 01/01/70 00:00 | |
| Handworked | 01/01/70 00:00 | |
| Hoping to use iron.... | 01/01/70 00:00 | |
| Yes, | 01/01/70 00:00 | |
| Pre tin the component pads... | 01/01/70 00:00 | |
| PreTinning to Raise Device | 01/01/70 00:00 | |
| I\'d recommend a bit more effort ... | 01/01/70 00:00 | |
| I See | 01/01/70 00:00 | |
| Sort of like the CP210x | 01/01/70 00:00 | |
| LINK-good for 5 more days | 01/01/70 00:00 | |
| For two parts on two prototypes?? | 01/01/70 00:00 | |
For two parts on two prototypes?? | 01/01/70 00:00 | |
| More on SMT in the kitchen | 01/01/70 00:00 |