| ??? 12/29/08 12:46 Read: times |
#161213 - Wear from temperature cycling Responding to: ???'s previous message |
Regular temperature cycling can result in metal fatigue in the bond wires so you should really think twice about cycling the power like that. Another failure source is the glue that holds the silicon chip. |
| Topic | Author | Date |
| Thermal stress reduction for IC | 01/01/70 00:00 | |
| Ask the manufacturer! | 01/01/70 00:00 | |
| Wear from temperature cycling | 01/01/70 00:00 | |
| loose vs lose | 01/01/70 00:00 | |
| What's the rated MTBF? | 01/01/70 00:00 | |
| The temperature may rise | 01/01/70 00:00 | |
| automotive grade is 125C | 01/01/70 00:00 | |
| You should have mentioned 150C | 01/01/70 00:00 | |
| Why does it rise? | 01/01/70 00:00 | |
| Though its able | 01/01/70 00:00 | |
| Sounds unlikely to me | 01/01/70 00:00 | |
| You need to consume power to be able to save power | 01/01/70 00:00 | |
| Why not having some numbers? | 01/01/70 00:00 | |
| Power dissipation | 01/01/70 00:00 | |
| Not 1.4W at 85C but 1.2-0.24 = 0.96W | 01/01/70 00:00 | |
| figure 1.4W | 01/01/70 00:00 | |
| Reversed logic | 01/01/70 00:00 | |
| Agreed | 01/01/70 00:00 | |
| Answers | 01/01/70 00:00 | |
| The webpage accepts | 01/01/70 00:00 | |
| Useful links... | 01/01/70 00:00 | |
| Tjmax | 01/01/70 00:00 | |
| Please read the datasheet again, carefully! | 01/01/70 00:00 | |
Not Obsession only info | 01/01/70 00:00 |