We happen to sell the products to many countries. We have a requirement currently, where the user has requested -40 degrees operation. I can change the components to mil grade. But I was curios as to what would happen if I use existing components (except battery/crystal/caps) - essentially chips - at low temperatures. I am sure that I wouldn't get any support, and I am also sure that the possible outcome wouldn't be discussed in datasheet, but I was sure that some of you would be able to throw some light on the expected behaviour. Will the silicon shrink and cause issue or whatever..