| ??? 03/05/12 23:30 Read: times |
#186436 - It doesn't have to be a PITA ... Responding to: ???'s previous message |
I used an ethernet PHY in this package back in '03 and found that, with proper pad shape and location, it was pretty easy to make 'em stick and make good solder joint. The solder paste has to be quite uniform, though. Hand soldering the prototypes, particularly before the pad shape and dimensions were worked out, was quite an exercise. When the parts didn't work properly, it was hard to guess whether they'd been overheated or simply lacked good contact. Further, there was a heatsinking surface on the underside that was hard to get hot enough. Providing an exit path for the heat was another interesting exercise.
RE |
| Topic | Author | Date |
| Precision32 - SiLabs jumps on Cortex-M3 bandwagon | 01/01/70 00:00 | |
| QFN indicates PLCC, doesn't it? | 01/01/70 00:00 | |
| QFN is "lead-less" | 01/01/70 00:00 | |
| harder to mount | 01/01/70 00:00 | |
| Glue | 01/01/70 00:00 | |
| Glue and reflow? | 01/01/70 00:00 | |
| Cyanoacrylic type glue | 01/01/70 00:00 | |
| Is it used in mass production? | 01/01/70 00:00 | |
| I was wrong about the glue type for manufacture | 01/01/70 00:00 | |
| Nevertheless... | 01/01/70 00:00 | |
| Dispense | 01/01/70 00:00 | |
| Again... | 01/01/70 00:00 | |
| re: Glue | 01/01/70 00:00 | |
| I hope this becomes standardized ... | 01/01/70 00:00 | |
| Eh?? | 01/01/70 00:00 | |
| It seems that the industry's heading for a consensus | 01/01/70 00:00 | |
| PLCCs marked QFN | 01/01/70 00:00 | |
| Anyway, | 01/01/70 00:00 | |
| It doesn't have to be a PITA ... | 01/01/70 00:00 | |
| That's the point! | 01/01/70 00:00 | |
Yes, and your starting point matters a great deal | 01/01/70 00:00 |