| ??? 03/05/12 21:18 Read: times |
#186434 - Anyway, Responding to: ???'s previous message |
PLCC package is phased out. First, 50-mil pitch is far too big for today's need for smaller and smaller packages. Second, the cost of PLCC package, as mentioned before, is much higher than QFN. Although I
hate QFN as it's PITA when it comes to repair/fix, we will have to learn to live with it. As we did with many other technologies that emerged in the last 20+ years. Remeber when SMD became common? |
| Topic | Author | Date |
| Precision32 - SiLabs jumps on Cortex-M3 bandwagon | 01/01/70 00:00 | |
| QFN indicates PLCC, doesn't it? | 01/01/70 00:00 | |
| QFN is "lead-less" | 01/01/70 00:00 | |
| harder to mount | 01/01/70 00:00 | |
| Glue | 01/01/70 00:00 | |
| Glue and reflow? | 01/01/70 00:00 | |
| Cyanoacrylic type glue | 01/01/70 00:00 | |
| Is it used in mass production? | 01/01/70 00:00 | |
| I was wrong about the glue type for manufacture | 01/01/70 00:00 | |
| Nevertheless... | 01/01/70 00:00 | |
| Dispense | 01/01/70 00:00 | |
| Again... | 01/01/70 00:00 | |
| re: Glue | 01/01/70 00:00 | |
| I hope this becomes standardized ... | 01/01/70 00:00 | |
| Eh?? | 01/01/70 00:00 | |
| It seems that the industry's heading for a consensus | 01/01/70 00:00 | |
| PLCCs marked QFN | 01/01/70 00:00 | |
| Anyway, | 01/01/70 00:00 | |
| It doesn't have to be a PITA ... | 01/01/70 00:00 | |
| That's the point! | 01/01/70 00:00 | |
Yes, and your starting point matters a great deal | 01/01/70 00:00 |