| ??? 03/03/12 16:10 Read: times |
#186391 - Glue and reflow? Responding to: ???'s previous message |
I am not sure if that can be done. Maybe if solder paste is printed first and then glue dots
are dispensed. And then what? If you pass the board through curing oven so the glue is cured, flux will evaporate from the paste so reflow will most likely fail. Leaving mounted boards overnight until glue dries out will also cause flux from the paste to evaporate and paste will dry too... |
| Topic | Author | Date |
| Precision32 - SiLabs jumps on Cortex-M3 bandwagon | 01/01/70 00:00 | |
| QFN indicates PLCC, doesn't it? | 01/01/70 00:00 | |
| QFN is "lead-less" | 01/01/70 00:00 | |
| harder to mount | 01/01/70 00:00 | |
| Glue | 01/01/70 00:00 | |
| Glue and reflow? | 01/01/70 00:00 | |
| Cyanoacrylic type glue | 01/01/70 00:00 | |
| Is it used in mass production? | 01/01/70 00:00 | |
| I was wrong about the glue type for manufacture | 01/01/70 00:00 | |
| Nevertheless... | 01/01/70 00:00 | |
| Dispense | 01/01/70 00:00 | |
| Again... | 01/01/70 00:00 | |
| re: Glue | 01/01/70 00:00 | |
| I hope this becomes standardized ... | 01/01/70 00:00 | |
| Eh?? | 01/01/70 00:00 | |
| It seems that the industry's heading for a consensus | 01/01/70 00:00 | |
| PLCCs marked QFN | 01/01/70 00:00 | |
| Anyway, | 01/01/70 00:00 | |
| It doesn't have to be a PITA ... | 01/01/70 00:00 | |
| That's the point! | 01/01/70 00:00 | |
Yes, and your starting point matters a great deal | 01/01/70 00:00 |