| ??? 03/05/12 21:13 Read: times |
#186433 - Again... Responding to: ???'s previous message |
how will you cure the glue? Remember, paste should already be there before you apply the glue.
Then, you have to cure the glue BEFORE reflow, otherwise why would you use it at all? And when you cure the glue, what will happen to the paste - flux will evaporate and paste will dry too... So, I still don't see how to use both glue and the paste. Glue is used when the board is designed to be wave-soldered afterwards... |
| Topic | Author | Date |
| Precision32 - SiLabs jumps on Cortex-M3 bandwagon | 01/01/70 00:00 | |
| QFN indicates PLCC, doesn't it? | 01/01/70 00:00 | |
| QFN is "lead-less" | 01/01/70 00:00 | |
| harder to mount | 01/01/70 00:00 | |
| Glue | 01/01/70 00:00 | |
| Glue and reflow? | 01/01/70 00:00 | |
| Cyanoacrylic type glue | 01/01/70 00:00 | |
| Is it used in mass production? | 01/01/70 00:00 | |
| I was wrong about the glue type for manufacture | 01/01/70 00:00 | |
| Nevertheless... | 01/01/70 00:00 | |
| Dispense | 01/01/70 00:00 | |
| Again... | 01/01/70 00:00 | |
| re: Glue | 01/01/70 00:00 | |
| I hope this becomes standardized ... | 01/01/70 00:00 | |
| Eh?? | 01/01/70 00:00 | |
| It seems that the industry's heading for a consensus | 01/01/70 00:00 | |
| PLCCs marked QFN | 01/01/70 00:00 | |
| Anyway, | 01/01/70 00:00 | |
| It doesn't have to be a PITA ... | 01/01/70 00:00 | |
| That's the point! | 01/01/70 00:00 | |
Yes, and your starting point matters a great deal | 01/01/70 00:00 |