I've been a believer in and producer of solid ground and power planes (not just wide busses) on the outer layers since the early '80's. The outer layers are "pads-only" with the remaining area used by either Vcc or Gnd and solder mask.

My wire-wrap boards all had a Vcc plane on the component side, and GND on the wiring side. Now that circuits have to have 1.2, 1.5, 1.8, 2.0, 2.2, as well as 3.3 volts, we're back to where things were in the mid-70's. with half a dozen power supplies. Of course, back then, it was bipolar 15, bipolar 12, bipolar 5, and maybe a Vtt layer of -2.7 or thereabouts in addition to ground planes ... <sigh> ... I rather liked the Intel advertisement of "5-volts only" in their products back then.

RE